The next Moto X may have heat pipes

moto-x-2016-leak

When you look at the flagship smartphone market, one company has a near monopoly when it comes to the SoC’s that power smartphones, and this company is Qualcomm.

Their SoCs can be found in just about every flagship smartphone, but in 2015, their dominance seemed to falter just a little bit. Their flagship chipset, the Snapdragon 810 was a overheating mess, and giants like Samsung took Qualcomm out of the equation all together. Then HTC Came out with a flagship smartphone using a Mediatek chipset, thus making matters just a tad bit worse for Qualcomm.

However, Qualcomm is working on its Snapdragon 820 SoC, and is claiming a huge performance improvement (not that we need it) without heating issues.

But the next Moto X, which is rumored to have a Snapdragon 820 SoC is also rumored to have heat pipes, which doesn’t bode well for the SoC. If the Snapdragon 820 too overheats, then it would be a great opportunity for rivals like Mediatek to step in and grab some market share.

The next Moto X would also have a fingerprint sensor, which is fast appearing on every flagship smartphone.

We can’t know for sure till the official announcement, of course. What do you think? Is it time to bring desktop-class fans and cooling solutions into our smartphones? We kid, we kid.

Advertisements

What are your Thoughts? Speak your Mind!

Fill in your details below or click an icon to log in:

WordPress.com Logo

You are commenting using your WordPress.com account. Log Out / Change )

Twitter picture

You are commenting using your Twitter account. Log Out / Change )

Facebook photo

You are commenting using your Facebook account. Log Out / Change )

Google+ photo

You are commenting using your Google+ account. Log Out / Change )

Connecting to %s